Endosidin7 is a specific inhibitor for plant callose deposition during cytokinesis. Endosidin7 inhibits cytokinesis-specific callose deposition at the cell plate, disrupts cell plate maturation, and alters localization of cell plate-associated proteins during late cell plate development. Endosidin7 slows root growth and induces formation of cell wall stubs in Arabidopsis thaliana seedlings [1].
In Vitro, Endosidin7 (25-1000 µM; 2-3 h) does not alter YFP-KNOLLE accumulation at the cell plate, callose deposition, or cell plate morphology in maize leaf epidermal cells[1]. Endosidin7 (10 µM; 5 day) does not inhibit root growth or cause cell plate defects in maize seedling roots[1]. Endosidin7 (10 µM; 5 day) inhibits root growth and causes cell plate defects in Arabidopsis thaliana seedling roots, confirming the reagent's activity in a known sensitive system[1]. Endosidin7 (50 µM; 2 h) causes cell plate defects and inhibits callose deposition in Arabidopsis thaliana seedling roots, confirming the reagent's activity in a known sensitive system[1].
References:
[1]. Allsman LA, et al. Subcellular positioning during cell division and cell plate formation in maize. Front Plant Sci. 2023;14:1204889. Published 2023 Jul 7.
In Vitro, Endosidin7 (25-1000 µM; 2-3 h) does not alter YFP-KNOLLE accumulation at the cell plate, callose deposition, or cell plate morphology in maize leaf epidermal cells[1]. Endosidin7 (10 µM; 5 day) does not inhibit root growth or cause cell plate defects in maize seedling roots[1]. Endosidin7 (10 µM; 5 day) inhibits root growth and causes cell plate defects in Arabidopsis thaliana seedling roots, confirming the reagent's activity in a known sensitive system[1]. Endosidin7 (50 µM; 2 h) causes cell plate defects and inhibits callose deposition in Arabidopsis thaliana seedling roots, confirming the reagent's activity in a known sensitive system[1].
References:
[1]. Allsman LA, et al. Subcellular positioning during cell division and cell plate formation in maize. Front Plant Sci. 2023;14:1204889. Published 2023 Jul 7.
















